Job Description:
Perform electrical and physical failure analysis on RF power amplifier products and linear products to support the company goal of improving product reliability and performance.

Understand, from a reliability standpoint, the materials, properties, process capability and techniques used in production, particularly in GaAs HBT and Si wafer fabrication.

Make recommendations for design engineering, process engineering and packaging engineering on selection, manufacturing, application and test of electronic components and systems.

LEVEL 4:
Uses electronic circuit and device physics concepts; develop proficiency in operating FA tools, such as X-ray, C-SAM, photon emission microscope, SEM, FIB, etc.

Read circuit schematics and layouts, and applies failure analysis procedures to identify the failure location and the root causes (troubleshooting capability).

Write failure analysis reports, including charts and photographs. Co-ordinate with design engineering, process engineering and package engineering to correct the product defect or weakness and to improve the product reliability.

Requirements:

B.S in science or EE. Advanced degree and FA experience required.

Hands on lab experience preferred with tool such as optical microscope, X-ray, C-SAM, SEM and photo emission microscope

Client is an innovator of high performance analog and mixed signal semiconductors enabling mobile connectivity.

The company's power amplifiers, front-end modules and direct conversion radios are at the heart of many of today's leading-edge multimedia handsets. Leveraging core technologies.